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High performance IC package thermal management material

Based on the customer chip architecture design and power level, we offer  the novle thermal-eletricalinsulation packaging materials and its processing technologies along  the various levels of chip packaging form(0-3 levels), so as to realize the precise application for customized cases with the internationally leading high-end chip packaging materials and solutions. Challenging the working condition of high junction temperature and high power intensivity of the integrated chip system for customers, to achieve the packaging heat dissipation solution with hyper features of ultra-uniform thermal conductivity, lightweight, easy processing and high product design freedom. Thereby, we constantly improve the electrical breakdown strength of packaging materials, and push the cut-edge of the super lower thermal resistance coefficient of packaging system.